The reason why the chip should be tested for burn-in test

There are two types of product quality problems caused by unreasonable design, raw materials or process measures during the manufacture of electronic products:

The first category is that the performance parameters of the products do not meet the standards, and the products produced do not meet the requirements for use;
The second type is potential defects, which cannot be found by general testing methods, but need to be gradually exposed during use, such as silicon wafer surface contamination, tissue instability, solder voids, chip and case thermal resistance matching Bad, etc.

Generally, this kind of defect needs to be activated (exposed) after the components work at rated power and normal operating temperature for about a thousand hours. Obviously, it is unrealistic to test each component for a thousand hours, so it is necessary to apply thermal stress and bias to it, such as high temperature power stress test, to accelerate the early exposure of such defects. That is to apply thermal, electrical, mechanical or a variety of comprehensive external stresses to electronic products, simulate harsh working environment, eliminate processing stress and residual solvents and other substances, make latent faults appear in advance, and make the product pass the early stage of the failed bathtub characteristics as soon as possible At this stage, it enters a stable period of high reliability.

Among the electronic product manufacturers, the widely used aging screening items include high temperature storage aging, high and low temperature cycle aging, high and low temperature impact aging, and high temperature power aging. Among them, high temperature power aging is currently the most used test item. High temperature power aging is to energize components and simulate their working conditions in the actual circuit, plus high temperature between +80~+180 ℃ for several hours to tens of hours of aging, this is a kind of component Various potential faults have effective methods of screening.

Through high-temperature aging, the defects of components, welding and assembly, and other hidden dangers in the production process can be exposed in advance. After aging, electrical parameter measurement is performed to screen out the components that have failed or changed value, and eliminate the early failure of the product as much as possible. For normal use, ensure that the products shipped from the factory can stand the test of time.

In order to ensure that the chips shipped from the factory have no problems, it is necessary to test before leaving the factory to ensure functional integrity. As a mass-produced thing, large-scale automated testing is the only solution. It is impossible to complete such tasks by manual or bench test. The chip high and low temperature aging test is actually a relatively large category. Generally, it is divided into wafer test and final test from the test object. The objects are the chip that has not been packaged and the chip that has been packaged.

The purpose of chip testing is to save costs as much as possible while finding a problem-free chip, so the types of defects that are easy to detect or more common will be detected first. Generally speaking, the first thing to do is the connectivity test, which we call the continuity test. This is to check whether the connectivity of each pin is normal.

LNEYA actively explores and researches chip aging test temperature system, which is mainly used for temperature test simulation in semiconductor testing. It has wide temperature orientation and high temperature rise and fall. The temperature range is -92°C~250°C, which is suitable for various test requirements. . Committed to solving the problem of temperature control lag in electronic components. Ultra high temperature cooling technology can directly cool from 300°C.

TES series equipment is suitable for precise temperature control of electronic components. In the manufacture of semiconductor electronic components used in harsh environments, the IC package assembly and engineering and production test stages include electronic thermal testing and other environmental test simulations at temperatures (-45°C to +250°C). Once put into practical use, these semiconductor devices and electronic products can be exposed to extreme environmental conditions to meet the stringent military and telecommunications reliability standards.

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