Temperature influence on semiconductor and control system

In the production of semiconductors and the testing of electronic components, there are numerous processes that must be exactly tempered. These include, for example, the organometallic vapor phase deposition (MOCVD) in semiconductor coating as a precursor of LED production. Other typical temperature- dependent investigations in the semiconductor industry include stress tests for function and load testing, environmental simulations, and in-circuit tests of electronic assemblies.

Controlling temperature and humidity is critical to the life and performance of semiconductors. Semiconductors are usually very fragile, and small fluctuations in temperature or light contaminants such as dust or dirt can affect the operation of semiconductors.

The temperature coefficient of resistance of the semiconductor is negative, which means that the conductivity increases after heating and the resistance decreases. As the energy increases, the heat applied to the semiconductor material causes the outermost electrons to separate from the nuclei of the material compound. These free electrons become conductive.

As the number of free electrons increases, the resistance will decrease. The temperature must be kept within a certain range in order to promote the normal functioning of electronic equipment working with semiconductors. In semiconductor manufacturing, strict temperature control is more important.

LNEYA’s advanced liquid temperature control technology is mainly used for temperature test simulation in semiconductor testing. It has a wide temperature orientation and high temperature rise and fall. The temperature range is -92°C~250°C, which is suitable for various test requirements. Solve the problem of temperature control lag in electronic components. Ultra high temperature cooling technology can directly cool from 300°C.

The semiconductor test temperature control system is used in the manufacture of semiconductor electronic components in harsh environments. The IC package assembly and engineering and production test stages include electronic thermal testing and other environmental tests at temperatures (-45°C to +250°C) simulation. Once the semiconductor electronic components are put into practical use, they can be exposed to extreme environmental conditions to meet the stringent military and telecommunications reliability standards.

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